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Responsible for process parameter verification and optimization, continuous yield improvement, etc.;

Responsible for production line difficult product improvement;

Responsible for process and standard document development, update and personnel training;

Responsible for the analysis and improvement of various anomalies related to the production line;

Other matters arranged by the superior.

College degree or above, major in microelectronics or mechanical engineering is preferred;

At least 3 years electroplating process experience, clear thinking, with strong logic ability, report editing ability;

Proficient in office and analysis: Excel/Word/JMP/Minitab, etc.

Skill requirements: electroplating agent solution analysis, glue removal process, flash removal process, electroplating impurity analysis;

Have the sense of teamwork, good communication and cooperation, have the ability to work independently;

Familiar with PPAP, SPC/FMEA, 8D and other tools;

Responsible for product structure program planning, design, and development.

Responsible for product structure program evaluation, structure envelope design; including product material selection, manufacturing process technology planning, mold manufacturing, product ID feasibility assessment.

According to the APQP development process program to promote the new product from design to validation, mass production and other related development work.

Familiar with FMEA (or FTA) design analysis, APQP program documents.

Bachelor’s degree or above, majoring in mechanical design, skilled in the use of various drawing software (such as CATIA, UG, IDEA, I-DEAS, PRO-E, Auto CAD, SOLIDWORKS) and office software.

Familiar with plastic, hardware product design and mold requirements.

APQP technical document preparation and archiving management.

Have good business communication, supplier coordination and negotiation ability, able to independently complete the product design and development follow-up, and analyze and solve the design problems found in the development process;

Obey the company's management, and can complete other related work assigned by the leadership.

Product experience: experience in front-loading car recorder, streaming media rearview mirror, electronic outside rearview mirror is preferred.

Job responsibilities

Responsible for product software design specification planning, and product software related module standard design planning.

Responsible for the product underlying embedded software, and communication, APP application layer software writing and debugging;

According to CMMI and APSICE development management process, responsible for product design software module document design.

According to CAN_BUS or Ethernet network protocol standards, responsible for product software diagnostic design, writing and tuning.

Familiar with Ambarella / NOVATEK / Hesse / Horizon / NVIDIA / Qualcomm and other programs, proficient in C / C + + + language;

Embedded application software development experience, with embedded product software system architecture experience and ability.

Familiar with embedded application programming under Linux system, familiar with embedded Linux driver development and debugging;

Familiar with network programming under Linux environment, familiar with network protocols, familiar with video transmission protocols (such as AVB protocol);

Work proactively, with good logical thinking ability, communication, analysis and problem-solving ability.

Obey the company's management, and can complete other related work assigned by the leadership.

System technology program planning, circuit schematic design, circuit signal simulation and circuit WCCA analysis, PCB Layout and EMC simulation.

According to APQP development process for new product design verification and leading new products into mass production;

New material selection and verification, skilled in the use of electronic design software (such as: Altium Design / Cadence or PADS, pspice), Office and other related applications.

Familiar with FMEA (or FTA) design analysis, APQP program documents.

More than 5 years of experience in the development of front-end automotive electronic products.

Familiar with product design and production process, familiar with high-speed circuit board design, 4–6-layer board design experience.

With the ability to independently design analog discrete circuits and digital circuits.

With independent design of RF circuits and the ability to independently debug RF circuits.

With good logical thinking ability, can support the customer project project meeting communication skills, project analysis capabilities, problem-solving skills